IBM researchers have shown the possibility of using a network of tiny pipes of water to cool next-generation PC chips.

Experts at the firm have created a prototype device that has thousands of “hair-width” cooling arteries, which they believe may be a solution to the increasing amount of heat pumped out by chips as they become smaller and more densely packed with components.

The researchers demonstrated the technology in IBM’s 3D chips, where circuits are stacked one on top of the other.

They say that vertical laying of chips, rather than side by side, reduces the distance data has to travel, enhances performance and saves critical space.  Source

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